JANTX1N6488US
vs
1N4488USE3
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROSEMI CORP
Package Description
HERMETIC SEALED, GLASS PACKAGE-2
Reach Compliance Code
compliant
compliant
Additional Feature
METALLURGICALLY BONDED
Case Connection
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JESD-30 Code
O-LELF-R2
O-LELF-R2
JESD-609 Code
e0
Number of Elements
1
1
Number of Terminals
2
2
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Polarity
UNIDIRECTIONAL
Power Dissipation-Max
1.5 W
1.5 W
Qualification Status
Qualified
Reference Standard
MIL-19500
Reference Voltage-Nom
4.3 V
91 V
Surface Mount
YES
YES
Technology
ZENER
ZENER
Terminal Finish
TIN LEAD
PURE MATTE TIN
Terminal Form
WRAP AROUND
WRAP AROUND
Terminal Position
END
END
Voltage Tol-Max
5%
5%
Working Test Current
58 mA
2.8 mA
Base Number Matches
4
1
ECCN Code
EAR99
HTS Code
8541.10.00.50
Dynamic Impedance-Max
200 Ω
Operating Temperature-Max
175 °C
Compare JANTX1N6488US with alternatives
Compare 1N4488USE3 with alternatives