JANTX1N4976DUS
vs
BZX84-C62,235
feature comparison
All Stats
Differences Only
Rohs Code
No
Yes
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
NXP SEMICONDUCTORS
Package Description
HERMETIC SEALED, GLASS PACKAGE-2
R-PDSO-G3
Reach Compliance Code
compliant
compliant
Factory Lead Time
52 Weeks
Case Connection
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JESD-30 Code
O-LELF-R2
R-PDSO-G3
JESD-609 Code
e0
e3
Number of Elements
1
1
Number of Terminals
2
3
Package Body Material
GLASS
PLASTIC/EPOXY
Package Shape
ROUND
RECTANGULAR
Package Style
LONG FORM
SMALL OUTLINE
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
5 W
0.25 W
Qualification Status
Qualified
Not Qualified
Reference Standard
MIL-19500/356H
Reference Voltage-Nom
56 V
62 V
Surface Mount
YES
YES
Technology
ZENER
ZENER
Terminal Finish
TIN LEAD
TIN
Terminal Form
WRAP AROUND
GULL WING
Terminal Position
END
DUAL
Voltage Tol-Max
1%
5%
Working Test Current
20 mA
2 mA
Base Number Matches
3
2
Part Package Code
TO-236
Pin Count
3
Manufacturer Package Code
SOT23
ECCN Code
EAR99
HTS Code
8541.10.00.50
Dynamic Impedance-Max
215 Ω
JEDEC-95 Code
TO-236AB
Moisture Sensitivity Level
1
Operating Temperature-Max
150 °C
Operating Temperature-Min
-65 °C
Peak Reflow Temperature (Cel)
260
Reverse Current-Max
0.05 µA
Time@Peak Reflow Temperature-Max (s)
30
Voltage Temp Coeff-Max
71.6 mV/°C
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