JANTX1N4477C
vs
1N5035A
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
CENTRAL SEMICONDUCTOR CORP
Package Description
HERMETIC SEALED, GLASS PACKAGE-2
Reach Compliance Code
compliant
not_compliant
Factory Lead Time
28 Weeks
kg CO2e/kg
8.7
Average Weight (mg)
283
CO2e (mg)
2462.1
Category CO2 Kg
8.7
8.7
Compliance Temperature Grade
Military: -65C to +175C
Candidate List Date
2020-06-25
2019-01-15
Conflict Mineral Status
DRC Conflict Free
DRC Conflict Free Undeterminable
Conflict Mineral Status Source
CMRT V5.10
Conflict Minerals Statement
Qualifications
DLA
Additional Feature
HIGH RELIABILITY, METALLURGICALLY BONDED
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JEDEC-95 Code
DO-41
JESD-30 Code
O-LALF-W2
O-PALF-W2
JESD-609 Code
e0
e0
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
175 °C
150 °C
Operating Temperature-Min
-65 °C
Package Body Material
GLASS
PLASTIC/EPOXY
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
1.5 W
2.5 W
Qualification Status
Qualified
Not Qualified
Reference Standard
MIL-19500
Reference Voltage-Nom
33 V
30 V
Surface Mount
NO
NO
Technology
ZENER
ZENER
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
WIRE
WIRE
Terminal Position
AXIAL
AXIAL
Voltage Tol-Max
2%
5%
Working Test Current
7.5 mA
21 mA
Base Number Matches
3
2
Pbfree Code
ECCN Code
EAR99
HTS Code
8541.10.00.50
SVHC Over MCV
7439-92-1
Dynamic Impedance-Max
15 Ω
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