JANS1N6314C
vs
MSP1N5228C-1
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROSEMI CORP
Package Description
HERMETIC SEALED, GLASS, D PACKAGE-2
O-LALF-W2
Reach Compliance Code
compliant
compliant
Factory Lead Time
32 Weeks
Additional Feature
HIGH RELIABILITY, METALLURGICALLY BONDED
METALLURGICALLY BONDED
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
Dynamic Impedance-Max
20 Ω
JEDEC-95 Code
DO-35
DO-204AH
JESD-30 Code
O-LALF-W2
O-LALF-W2
JESD-609 Code
e0
e0
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
175 °C
175 °C
Operating Temperature-Min
-65 °C
-65 °C
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.5 W
0.48 W
Qualification Status
Qualified
Reference Standard
MIL-19500
MIL-19500
Reference Voltage-Nom
3.9 V
3.9 V
Surface Mount
NO
NO
Technology
ZENER
ZENER
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
WIRE
WIRE
Terminal Position
AXIAL
AXIAL
Voltage Tol-Max
2%
2%
Working Test Current
20 mA
20 mA
Base Number Matches
2
4
Pbfree Code
Part Package Code
DO-35
Pin Count
2
ECCN Code
EAR99
HTS Code
8541.10.00.50
Compare JANS1N6314C with alternatives
Compare MSP1N5228C-1 with alternatives