JANS1N6309CUS
vs
JAN1N6326US
feature comparison
All Stats
Differences Only
Rohs Code
No
No
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
MICROSEMI CORP
SENSITRON SEMICONDUCTOR
Part Package Code
MELF
Package Description
MELF-2
MELF-2
Pin Count
2
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.50
8541.10.00.50
Additional Feature
HIGH RELIABILITY, METALLURGICALLY BONDED
HIGH RELIABILITY, METALLURGICALLY BONDED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
Dynamic Impedance-Max
30 Ω
7 Ω
JESD-30 Code
O-LELF-R2
O-LELF-R2
JESD-609 Code
e0
Knee Impedance-Max
1200 Ω
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
175 °C
175 °C
Operating Temperature-Min
-65 °C
-55 °C
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.5 W
0.5 W
Qualification Status
Not Qualified
Qualified
Reference Standard
MIL-19500
MIL-19500
Reference Voltage-Nom
2.4 V
12 V
Reverse Current-Max
100 µA
Reverse Test Voltage
1 V
Surface Mount
YES
YES
Technology
ZENER
ZENER
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
WRAP AROUND
WRAP AROUND
Terminal Position
END
END
Voltage Tol-Max
2%
5%
Working Test Current
20 mA
20 mA
Base Number Matches
1
1
Pbfree Code
No
Case Connection
ISOLATED
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare JANS1N6309CUS with alternatives
Compare JAN1N6326US with alternatives