JANS1N5819UR-1
vs
1N5819UR-1E3
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Active
Ihs Manufacturer
SENSITRON SEMICONDUCTOR
MICROCHIP TECHNOLOGY INC
Part Package Code
DO-213AB
Package Description
HERMETIC SEALED PACKAGE-2
HERMETIC SEALED, GLASS, LL41, MELF-2
Pin Count
2
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
HTS Code
8541.10.00.80
Additional Feature
METALLURGICALLY BONDED
METALLURGICALLY BONDED
Application
GENERAL PURPOSE
GENERAL PURPOSE
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
RECTIFIER DIODE
RECTIFIER DIODE
JEDEC-95 Code
DO-213AB
DO-213AB
JESD-30 Code
O-XELF-R2
O-LELF-R2
Number of Elements
1
1
Number of Phases
1
1
Number of Terminals
2
2
Output Current-Max
1 A
1 A
Package Body Material
UNSPECIFIED
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Qualification Status
Not Qualified
Reference Standard
MIL-19500/586F
Surface Mount
YES
YES
Technology
SCHOTTKY
SCHOTTKY
Terminal Form
WRAP AROUND
WRAP AROUND
Terminal Position
END
END
Base Number Matches
1
2
Rohs Code
Factory Lead Time
24 Weeks
Samacsys Manufacturer
Microchip
Forward Voltage-Max (VF)
0.34 V
Non-rep Pk Forward Current-Max
25 A
Operating Temperature-Max
125 °C
Operating Temperature-Min
-65 °C
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Rep Pk Reverse Voltage-Max
45 V
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare JANS1N5819UR-1 with alternatives
Compare 1N5819UR-1E3 with alternatives