1N5819UR-1E3
vs
1N5819URHR
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
BKC SEMICONDUCTORS INC
Package Description
HERMETIC SEALED, GLASS, LL41, MELF-2
GLASS PACKAGE-2
Reach Compliance Code
compliant
unknown
Factory Lead Time
24 Weeks
Samacsys Manufacturer
Microchip
Additional Feature
METALLURGICALLY BONDED
HIGH RELIABILITY
Application
GENERAL PURPOSE
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
RECTIFIER DIODE
RECTIFIER DIODE
Forward Voltage-Max (VF)
0.34 V
0.8 V
JEDEC-95 Code
DO-213AB
DO-213AB
JESD-30 Code
O-LELF-R2
O-LELF-R2
Non-rep Pk Forward Current-Max
25 A
25 A
Number of Elements
1
1
Number of Phases
1
1
Number of Terminals
2
2
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-65 °C
-65 °C
Output Current-Max
1 A
1 A
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Rep Pk Reverse Voltage-Max
45 V
45 V
Surface Mount
YES
YES
Technology
SCHOTTKY
SCHOTTKY
Terminal Form
WRAP AROUND
WRAP AROUND
Terminal Position
END
END
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Base Number Matches
2
2
JESD-609 Code
e0
Qualification Status
Not Qualified
Terminal Finish
TIN LEAD
Compare 1N5819UR-1E3 with alternatives
Compare 1N5819URHR with alternatives