JANS1N5807US
vs
JAN1N5807US
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
MICROSEMI CORP
SENSITRON SEMICONDUCTOR
Part Package Code
MELF
MELF
Package Description
HERMETIC SEALED, GLASS, MELF-2
MELF-B, 2 PIN
Pin Count
2
2
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.80
8541.10.00.80
Additional Feature
HIGH RELIABILITY, METALLURGICALLY BONDED
HIGH RELIABILITY, METALLURGICALLY BONDED
Application
ULTRA FAST RECOVERY
ULTRA FAST RECOVERY
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
RECTIFIER DIODE
RECTIFIER DIODE
JESD-30 Code
O-LELF-R2
E-LELF-R2
JESD-609 Code
e0
e0
Non-rep Pk Forward Current-Max
125 A
125 A
Number of Elements
1
1
Number of Phases
1
1
Number of Terminals
2
2
Operating Temperature-Max
175 °C
175 °C
Operating Temperature-Min
-65 °C
-65 °C
Output Current-Max
3 A
6 A
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ELLIPTICAL
Package Style
LONG FORM
LONG FORM
Power Dissipation-Max
5 W
Qualification Status
Not Qualified
Qualified
Reference Standard
MIL-19500
MIL-19500
Rep Pk Reverse Voltage-Max
50 V
50 V
Reverse Recovery Time-Max
0.03 µs
0.03 µs
Surface Mount
YES
YES
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
WRAP AROUND
WRAP AROUND
Terminal Position
END
END
Base Number Matches
1
1
Forward Voltage-Max (VF)
0.875 V
Compare JANS1N5807US with alternatives
Compare JAN1N5807US with alternatives