JANS1N5303UR-1 vs 1N5303UR-1E3 feature comparison

JANS1N5303UR-1 Microsemi Corporation

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1N5303UR-1E3 Microsemi Corporation

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Pbfree Code No
Rohs Code No Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer MICROSEMI CORP MICROSEMI CORP
Part Package Code DO-213AB DO-213AB
Package Description HERMETIC SEALED, GLASS, LL41, MELF-2 ROHS COMPLIANT, HERMETIC SEALED, GLASS, LL41, MELF-2
Pin Count 2 2
Reach Compliance Code not_compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.70 8541.10.00.70
Samacsys Manufacturer Microsemi Corporation
Additional Feature METALLURGICALLY BONDED METALLURGICALLY BONDED
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type CURRENT REGULATOR DIODE CURRENT REGULATOR DIODE
JEDEC-95 Code DO-213AB DO-213AB
JESD-30 Code O-LELF-R2 O-LELF-R2
JESD-609 Code e0
Limiting Voltage-Max 1.65 V 1.65 V
Moisture Sensitivity Level 1
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 175 °C 175 °C
Operating Temperature-Min -65 °C -65 °C
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Power Dissipation-Max 0.5 W 0.5 W
Qualification Status Not Qualified
Reference Standard MIL-19500
Regulation Current-Nom (Ireg) 1.6 mA 1.6 mA
Surface Mount YES YES
Technology FIELD EFFECT FIELD EFFECT
Terminal Finish TIN LEAD
Terminal Form WRAP AROUND WRAP AROUND
Terminal Position END END
Base Number Matches 2 1

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