JANS1N4468CUS vs JANS1N4468D feature comparison

JANS1N4468CUS Microchip Technology Inc

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JANS1N4468D Microsemi Corporation

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Rohs Code No No
Part Life Cycle Code Active Transferred
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROSEMI CORP
Package Description HERMETIC SEALED, GLASS, D-5A, 2 PIN HERMETIC SEALED, GLASS PACKAGE-2
Reach Compliance Code compliant unknown
Factory Lead Time 32 Weeks
Additional Feature HIGH RELIABILITY, METALLURGICALLY BONDED HIGH RELIABILITY, METALLURGICALLY BONDED
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JESD-30 Code O-LELF-R2 O-LALF-W2
JESD-609 Code e0 e0
Number of Elements 1 1
Number of Terminals 2 2
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 1.5 W 1.5 W
Qualification Status Qualified Not Qualified
Reference Standard MIL-19500/406 MIL-19500
Reference Voltage-Nom 13 V 13 V
Surface Mount YES NO
Technology ZENER ZENER
Terminal Finish TIN LEAD TIN LEAD
Terminal Form WRAP AROUND WIRE
Terminal Position END AXIAL
Voltage Tol-Max 2% 1%
Working Test Current 19 mA 19 mA
Base Number Matches 2 2
Pbfree Code No
Pin Count 2
ECCN Code EAR99
HTS Code 8541.10.00.50
JEDEC-95 Code DO-41
Operating Temperature-Max 175 °C
Operating Temperature-Min -65 °C

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