JANKC1N5294
vs
1N5294E3
feature comparison
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
MICROSEMI CORP
|
MICROCHIP TECHNOLOGY INC
|
Part Package Code |
DIE
|
|
Package Description |
DIE-1
|
|
Pin Count |
1
|
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.10.00.40
|
8541.10.00.70
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
CURRENT REGULATOR DIODE
|
CURRENT REGULATOR DIODE
|
JESD-30 Code |
S-XUUC-N1
|
O-XALF-W2
|
JESD-609 Code |
e0
|
|
Limiting Voltage-Max |
1.2 V
|
1.2 V
|
Number of Elements |
1
|
1
|
Number of Terminals |
1
|
2
|
Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
Package Shape |
SQUARE
|
ROUND
|
Package Style |
UNCASED CHIP
|
LONG FORM
|
Qualification Status |
Not Qualified
|
|
Reference Standard |
MIL-19500/463
|
|
Regulation Current-Nom (Ireg) |
0.75 mA
|
0.75 mA
|
Rep Pk Reverse Voltage-Max |
100 V
|
100 V
|
Surface Mount |
YES
|
NO
|
Technology |
FIELD EFFECT
|
FIELD EFFECT
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
NO LEAD
|
WIRE
|
Terminal Position |
UPPER
|
AXIAL
|
Base Number Matches |
1
|
1
|
Rohs Code |
|
Yes
|
Case Connection |
|
ISOLATED
|
JEDEC-95 Code |
|
DO-35
|
Operating Temperature-Max |
|
175 °C
|
Operating Temperature-Min |
|
-65 °C
|
Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
Power Dissipation-Max |
|
0.5 W
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare JANKC1N5294 with alternatives
Compare 1N5294E3 with alternatives