JANKC1N5294
vs
1N5294TR-RECU
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
MICROSEMI CORP
CENTRAL SEMICONDUCTOR CORP
Part Package Code
DIE
DO-35
Package Description
DIE-1
HERMETIC SEALED, GLASS PACKAGE-2
Pin Count
1
2
Reach Compliance Code
compliant
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.40
8541.10.00.70
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
CURRENT REGULATOR DIODE
CURRENT REGULATOR DIODE
JESD-30 Code
S-XUUC-N1
O-LALF-W2
JESD-609 Code
e0
e0
Limiting Voltage-Max
1.2 V
1.2 V
Number of Elements
1
1
Number of Terminals
1
2
Package Body Material
UNSPECIFIED
GLASS
Package Shape
SQUARE
ROUND
Package Style
UNCASED CHIP
LONG FORM
Qualification Status
Not Qualified
Not Qualified
Reference Standard
MIL-19500/463
Regulation Current-Nom (Ireg)
0.75 mA
0.75 mA
Rep Pk Reverse Voltage-Max
100 V
100 V
Surface Mount
YES
NO
Technology
FIELD EFFECT
FIELD EFFECT
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
NO LEAD
WIRE
Terminal Position
UPPER
AXIAL
Base Number Matches
2
1
Pbfree Code
Rohs Code
Additional Feature
HIGH RELIABILITY
Case Connection
ISOLATED
JEDEC-95 Code
DO-35
Operating Temperature-Max
200 °C
Operating Temperature-Min
-65 °C
Power Dissipation-Max
0.6 W
Compare JANKC1N5294 with alternatives
Compare 1N5294TR-RECU with alternatives