JANHCA1N821
vs
1N821ATA2
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MOTOROLA INC
Package Description
HERMETIC SEALED, DIE-3
O-LALF-W2
Reach Compliance Code
compliant
unknown
kg CO2e/kg
8.7
Average Weight (mg)
1.1
CO2e (mg)
9.57
Category CO2 Kg
8.7
Candidate List Date
2020-06-25
Conflict Mineral Status
DRC Conflict Free
Conflict Mineral Status Source
CMRT V5.10
Qualifications
DLA, Rad Hard
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
Dynamic Impedance-Max
15 Ω
JESD-30 Code
S-XUUC-N3
O-LALF-W2
JESD-609 Code
e0
Number of Elements
1
1
Number of Terminals
3
2
Operating Temperature-Max
175 °C
175 °C
Package Body Material
UNSPECIFIED
GLASS
Package Shape
SQUARE
ROUND
Package Style
UNCASED CHIP
LONG FORM
Power Dissipation-Max
0.5 W
0.4 W
Qualification Status
Qualified
Not Qualified
Reference Standard
MIL-19500/159M
Reference Voltage-Nom
6.2 V
6.2 V
Surface Mount
YES
NO
Technology
ZENER
ZENER
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
NO LEAD
WIRE
Terminal Position
UPPER
AXIAL
Voltage Tol-Max
5%
5%
Working Test Current
7.5 mA
7.5 mA
Base Number Matches
1
1
ECCN Code
EAR99
HTS Code
8541.10.00.50
Case Connection
ISOLATED
Operating Temperature-Min
-55 °C
Voltage Temp Coeff-Max
0.62 mV/°C
Compare JANHCA1N821 with alternatives
Compare 1N821ATA2 with alternatives