JANHCA1N5519C
vs
MMBZ5227BT/R13
feature comparison
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
MICROSEMI CORP
|
PAN JIT INTERNATIONAL INC
|
Package Description |
DIE-2
|
R-PDSO-G3
|
Reach Compliance Code |
unknown
|
compliant
|
Additional Feature |
METALLURGICALLY BONDED
|
|
Case Connection |
CATHODE
|
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
ZENER DIODE
|
ZENER DIODE
|
JESD-30 Code |
S-XXUC-N2
|
R-PDSO-G3
|
JESD-609 Code |
e0
|
|
Number of Elements |
1
|
1
|
Number of Terminals |
2
|
3
|
Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
UNCASED CHIP
|
SMALL OUTLINE
|
Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
Power Dissipation-Max |
0.5 W
|
0.41 W
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Reference Standard |
MIL-19500/437E
|
|
Reference Voltage-Nom |
3.6 V
|
3.6 V
|
Surface Mount |
YES
|
YES
|
Technology |
ZENER
|
ZENER
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
NO LEAD
|
GULL WING
|
Terminal Position |
UNSPECIFIED
|
DUAL
|
Voltage Tol-Max |
2%
|
5%
|
Working Test Current |
20 mA
|
20 mA
|
Base Number Matches |
3
|
1
|
Pbfree Code |
|
Yes
|
Rohs Code |
|
Yes
|
Pin Count |
|
3
|
Operating Temperature-Max |
|
150 °C
|
Operating Temperature-Min |
|
-55 °C
|
Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare JANHCA1N5519C with alternatives
Compare MMBZ5227BT/R13 with alternatives