JANHCA1N5519C vs MSP1N5227BTR feature comparison

JANHCA1N5519C Compensated Devices Inc

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MSP1N5227BTR Microsemi Corporation

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer COMPENSATED DEVICES INC MICROSEMI CORP
Package Description DIE-2 HERMETIC SEALED, GLASS, DO-7, 2 PIN
Reach Compliance Code unknown unknown
Additional Feature METALLURGICALLY BONDED
Case Connection CATHODE ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JESD-30 Code S-XXUC-N2 O-LALF-W2
Number of Elements 1 1
Number of Terminals 2 2
Package Body Material UNSPECIFIED GLASS
Package Shape SQUARE ROUND
Package Style UNCASED CHIP LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.5 W 0.417 W
Qualification Status Not Qualified Not Qualified
Reference Standard MIL-19500/437E
Reference Voltage-Nom 3.6 V 3.6 V
Surface Mount YES NO
Technology ZENER ZENER
Terminal Form NO LEAD WIRE
Terminal Position UNSPECIFIED AXIAL
Voltage Tol-Max 2% 5%
Working Test Current 20 mA 20 mA
Base Number Matches 3 1
Rohs Code No
Part Package Code DO-7
Pin Count 2
ECCN Code EAR99
HTS Code 8541.10.00.50
JEDEC-95 Code DO-204AA
JESD-609 Code e0
Moisture Sensitivity Level 1
Operating Temperature-Max 175 °C
Operating Temperature-Min -65 °C
Terminal Finish TIN LEAD

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