JANHCA1N5309
vs
JANTX1N5309-1
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
AEROFLEX/METELICS INC
|
Package Description |
HERMETIC SEALED, DIE-2
|
GLASS PACKAGE-2
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.10.00.40
|
8541.10.00.70
|
Case Connection |
CATHODE
|
ISOLATED
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
CURRENT REGULATOR DIODE
|
CURRENT REGULATOR DIODE
|
JESD-30 Code |
S-XXUC-N2
|
O-LALF-W2
|
JESD-609 Code |
e0
|
e0
|
Limiting Voltage-Max |
2.25 V
|
2.25 V
|
Number of Elements |
1
|
1
|
Number of Terminals |
2
|
2
|
Package Body Material |
UNSPECIFIED
|
GLASS
|
Package Shape |
SQUARE
|
ROUND
|
Package Style |
UNCASED CHIP
|
LONG FORM
|
Power Dissipation-Max |
0.5 W
|
0.5 W
|
Qualification Status |
Qualified
|
Not Qualified
|
Reference Standard |
MIL-19500/463G
|
MIL-19500/463
|
Regulation Current-Nom (Ireg) |
3 mA
|
3 mA
|
Rep Pk Reverse Voltage-Max |
100 V
|
100 V
|
Surface Mount |
YES
|
NO
|
Technology |
FIELD EFFECT
|
FIELD EFFECT
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN LEAD
|
Terminal Form |
NO LEAD
|
WIRE
|
Terminal Position |
UNSPECIFIED
|
AXIAL
|
Base Number Matches |
3
|
9
|
Pbfree Code |
|
No
|
Part Package Code |
|
DO-7
|
Pin Count |
|
2
|
JEDEC-95 Code |
|
DO-7
|
|
|
|
Compare JANHCA1N5309 with alternatives
Compare JANTX1N5309-1 with alternatives