JANHCA1N5290
vs
JAN1N5290
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MOTOROLA INC
Package Description
HERMETIC SEALED, DIE-2
O-LALF-W2
Reach Compliance Code
compliant
unknown
Case Connection
CATHODE
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
CURRENT REGULATOR DIODE
CURRENT REGULATOR DIODE
JESD-30 Code
S-XXUC-N2
O-LALF-W2
JESD-609 Code
e0
Limiting Voltage-Max
1.05 V
1.05 V
Number of Elements
1
1
Number of Terminals
2
2
Package Body Material
UNSPECIFIED
GLASS
Package Shape
SQUARE
ROUND
Package Style
UNCASED CHIP
LONG FORM
Power Dissipation-Max
0.5 W
0.6 W
Qualification Status
Qualified
Not Qualified
Reference Standard
MIL-19500/463G
Regulation Current-Nom (Ireg)
0.47 mA
0.47 mA
Rep Pk Reverse Voltage-Max
100 V
100 V
Surface Mount
YES
NO
Technology
FIELD EFFECT
FIELD EFFECT
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
NO LEAD
WIRE
Terminal Position
UNSPECIFIED
AXIAL
Base Number Matches
4
6
ECCN Code
EAR99
HTS Code
8541.10.00.70
JEDEC-95 Code
DO-204AA
Knee Impedance-Max
750000 Ω
Operating Temperature-Max
200 °C
Operating Temperature-Min
-55 °C
Compare JANHCA1N5290 with alternatives
Compare JAN1N5290 with alternatives