JANHCA1N4123C
vs
JANHCA1N4123C
feature comparison
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
COMPENSATED DEVICES INC
|
MICROSEMI CORP
|
Package Description |
DIE-2
|
DIE-2
|
Reach Compliance Code |
unknown
|
compliant
|
Additional Feature |
METALLURGICALLY BONDED
|
METALLURGICALLY BONDED
|
Case Connection |
CATHODE
|
CATHODE
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
ZENER DIODE
|
ZENER DIODE
|
JESD-30 Code |
S-XXUC-N2
|
S-XXUC-N2
|
Number of Elements |
1
|
1
|
Number of Terminals |
2
|
2
|
Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
UNCASED CHIP
|
UNCASED CHIP
|
Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
Power Dissipation-Max |
0.5 W
|
0.25 W
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Reference Standard |
MIL-19500/435F
|
MIL-19500/435F
|
Reference Voltage-Nom |
39 V
|
39 V
|
Surface Mount |
YES
|
YES
|
Technology |
ZENER
|
ZENER
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Position |
UNSPECIFIED
|
UNSPECIFIED
|
Voltage Tol-Max |
2%
|
2%
|
Working Test Current |
0.25 mA
|
0.25 mA
|
Base Number Matches |
1
|
1
|
Rohs Code |
|
No
|
Part Package Code |
|
DIE
|
Pin Count |
|
2
|
ECCN Code |
|
EAR99
|
HTS Code |
|
8541.10.00.50
|
Dynamic Impedance-Max |
|
200 Ω
|
JESD-609 Code |
|
e0
|
Operating Temperature-Max |
|
200 °C
|
Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
|
|
|
Compare JANHCA1N4123C with alternatives
Compare JANHCA1N4123C with alternatives