JANHCA1N4123 vs JANTXV1N4123C-1 feature comparison

JANHCA1N4123 Microsemi Corporation

Buy Now

JANTXV1N4123C-1 Cobham Semiconductor Solutions

Buy Now Datasheet
Rohs Code No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer MICROSEMI CORP AEROFLEX/METELICS INC
Part Package Code DIE DO-35
Package Description DIE-2 HERMETIC SEALED, GLASS PACKAGE-2
Pin Count 2 2
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Additional Feature METALLURGICALLY BONDED METALLURGICALLY BONDED
Case Connection CATHODE ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JESD-30 Code S-XXUC-N2 O-LALF-W2
JESD-609 Code e0 e0
Number of Elements 1 1
Number of Terminals 2 2
Package Body Material UNSPECIFIED GLASS
Package Shape SQUARE ROUND
Package Style UNCASED CHIP LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Qualification Status Not Qualified Not Qualified
Reference Standard MIL-19500/435F MIL-19500/435
Reference Voltage-Nom 39 V 39 V
Surface Mount YES NO
Technology ZENER ZENER
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form NO LEAD WIRE
Terminal Position UNSPECIFIED AXIAL
Voltage Tol-Max 5% 2%
Working Test Current 0.25 mA 0.25 mA
Base Number Matches 3 1
JEDEC-95 Code DO-35
Power Dissipation-Max 0.5 W

Compare JANHCA1N4123 with alternatives

Compare JANTXV1N4123C-1 with alternatives