JAN2N6901
vs
SFF6661/39
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
MICROSEMI CORP
|
SOLID STATE DEVICES INC
|
| Part Package Code |
BCY
|
TO-39
|
| Package Description |
FORMERLY TO-39, 3 PIN
|
HERMETIC SEALED PACKAGE-3
|
| Pin Count |
2
|
3
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| Case Connection |
DRAIN
|
|
| Configuration |
SINGLE WITH BUILT-IN DIODE
|
|
| DS Breakdown Voltage-Min |
100 V
|
|
| Drain Current-Max (ID) |
1.69 A
|
|
| Drain-source On Resistance-Max |
1.4 Ω
|
|
| FET Technology |
METAL-OXIDE SEMICONDUCTOR
|
|
| JEDEC-95 Code |
TO-205AF
|
|
| JESD-30 Code |
O-MBCY-W3
|
|
| Number of Elements |
1
|
|
| Number of Terminals |
3
|
|
| Operating Mode |
ENHANCEMENT MODE
|
|
| Package Body Material |
METAL
|
|
| Package Shape |
ROUND
|
|
| Package Style |
CYLINDRICAL
|
|
| Polarity/Channel Type |
N-CHANNEL
|
|
| Qualification Status |
Qualified
|
Not Qualified
|
| Reference Standard |
MIL-19500/570B
|
|
| Surface Mount |
NO
|
|
| Terminal Form |
WIRE
|
|
| Terminal Position |
BOTTOM
|
|
| Transistor Application |
SWITCHING
|
|
| Transistor Element Material |
SILICON
|
|
| Base Number Matches |
3
|
1
|
|
|
|
Compare JAN2N6901 with alternatives
Compare SFF6661/39 with alternatives