SFF6661/39
vs
SJVN2210N2
feature comparison
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
SOLID STATE DEVICES INC
|
SUPERTEX INC
|
| Part Package Code |
TO-39
|
|
| Package Description |
HERMETIC SEALED PACKAGE-3
|
CYLINDRICAL, O-MBCY-W3
|
| Pin Count |
3
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Base Number Matches |
1
|
1
|
| Additional Feature |
|
HIGH INPUT IMPEDANCE, HIGH RELIABILITY
|
| Case Connection |
|
DRAIN
|
| Configuration |
|
SINGLE WITH BUILT-IN DIODE
|
| DS Breakdown Voltage-Min |
|
100 V
|
| Drain Current-Max (ID) |
|
1.7 A
|
| Drain-source On Resistance-Max |
|
0.35 Ω
|
| FET Technology |
|
METAL-OXIDE SEMICONDUCTOR
|
| Feedback Cap-Max (Crss) |
|
65 pF
|
| JEDEC-95 Code |
|
TO-39
|
| JESD-30 Code |
|
O-MBCY-W3
|
| Number of Elements |
|
1
|
| Number of Terminals |
|
3
|
| Operating Mode |
|
ENHANCEMENT MODE
|
| Package Body Material |
|
METAL
|
| Package Shape |
|
ROUND
|
| Package Style |
|
CYLINDRICAL
|
| Polarity/Channel Type |
|
N-CHANNEL
|
| Surface Mount |
|
NO
|
| Terminal Form |
|
WIRE
|
| Terminal Position |
|
BOTTOM
|
| Transistor Application |
|
SWITCHING
|
| Transistor Element Material |
|
SILICON
|
|
|
|
Compare SFF6661/39 with alternatives
Compare SJVN2210N2 with alternatives