JAN2N4033UB
vs
JANTXV2N4033UB
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
MICROSEMI CORP
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
CERAMIC PACKAGE-3
|
CERAMIC PACKAGE-3
|
Pin Count |
3
|
|
Reach Compliance Code |
not_compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
Samacsys Manufacturer |
Microsemi Corporation
|
|
Collector Current-Max (IC) |
1 A
|
1 A
|
Collector-Emitter Voltage-Max |
80 V
|
80 V
|
Configuration |
SINGLE
|
SINGLE
|
DC Current Gain-Min (hFE) |
25
|
25
|
JESD-30 Code |
R-CDSO-N3
|
R-CDSO-N3
|
JESD-609 Code |
e0
|
e0
|
Number of Elements |
1
|
1
|
Number of Terminals |
3
|
3
|
Operating Temperature-Max |
200 °C
|
200 °C
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
Polarity/Channel Type |
PNP
|
PNP
|
Qualification Status |
Not Qualified
|
Qualified
|
Reference Standard |
MIL-19500/512
|
MIL-19500/512
|
Surface Mount |
YES
|
YES
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Position |
DUAL
|
DUAL
|
Transistor Application |
SWITCHING
|
SWITCHING
|
Transistor Element Material |
SILICON
|
SILICON
|
Turn-off Time-Max (toff) |
210 ns
|
210 ns
|
Turn-on Time-Max (ton) |
40 ns
|
40 ns
|
Base Number Matches |
1
|
1
|
HTS Code |
|
8541.21.00.95
|
|
|
|
Compare JAN2N4033UB with alternatives
Compare JANTXV2N4033UB with alternatives