JAN1N977B-1
vs
1N977E3TR
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROSEMI CORP
Package Description
DO-35, 2 PIN
O-LALF-W2
Reach Compliance Code
compliant
unknown
Factory Lead Time
20 Weeks
Additional Feature
METALLURGICALLY BONDED
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
Dynamic Impedance-Max
105 Ω
105 Ω
JEDEC-95 Code
DO-204AH
DO-204AA
JESD-30 Code
O-LALF-W2
O-LALF-W2
JESD-609 Code
e0
e3
Knee Impedance-Max
1500 Ω
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
175 °C
175 °C
Operating Temperature-Min
-65 °C
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.4 W
0.417 W
Qualification Status
Qualified
Not Qualified
Reference Standard
MIL-19500
Reference Voltage-Nom
47 V
47 V
Reverse Current-Max
0.5 µA
Reverse Test Voltage
36 V
Surface Mount
NO
NO
Technology
ZENER
ZENER
Terminal Finish
TIN LEAD
MATTE TIN
Terminal Form
WIRE
WIRE
Terminal Position
AXIAL
AXIAL
Voltage Temp Coeff-Max
44.65 mV/°C
Voltage Tol-Max
5%
20%
Working Test Current
2.7 mA
2.7 mA
Base Number Matches
2
6
Part Package Code
DO-7
Pin Count
2
ECCN Code
EAR99
HTS Code
8541.10.00.50
Compare JAN1N977B-1 with alternatives
Compare 1N977E3TR with alternatives