JAN1N827-1
vs
JANKCA1N827
feature comparison
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
COBHAM PLC
|
MICROSEMI CORP
|
Package Description |
HERMETIC SEALED PACKAGE-2
|
HERMETIC SEALED, DIE-3
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.10.00.50
|
8541.10.00.50
|
Case Connection |
ISOLATED
|
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
ZENER DIODE
|
ZENER DIODE
|
JEDEC-95 Code |
DO-35
|
|
JESD-30 Code |
O-XALF-W2
|
S-XUUC-N3
|
JESD-609 Code |
e0
|
e0
|
Number of Elements |
1
|
1
|
Number of Terminals |
2
|
3
|
Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
Package Shape |
ROUND
|
SQUARE
|
Package Style |
LONG FORM
|
UNCASED CHIP
|
Power Dissipation-Max |
0.5 W
|
0.5 W
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Reference Standard |
MIL-19500/159M
|
MIL-19500/159M
|
Reference Voltage-Nom |
6.2 V
|
6.2 V
|
Surface Mount |
NO
|
YES
|
Technology |
ZENER
|
ZENER
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
WIRE
|
NO LEAD
|
Terminal Position |
AXIAL
|
UPPER
|
Voltage Temp Coeff-Max |
0.062 mV/°C
|
|
Voltage Tol-Max |
4.84%
|
5%
|
Base Number Matches |
8
|
4
|
Pbfree Code |
|
No
|
Rohs Code |
|
No
|
Part Package Code |
|
DIE
|
Pin Count |
|
3
|
|
|
|
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