JANKCA1N827
vs
JANTXV1N827
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROSEMI CORP
Package Description
HERMETIC SEALED, DIE-3
O-LALF-W2
Reach Compliance Code
compliant
not_compliant
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JESD-30 Code
S-XUUC-N3
O-LALF-W2
JESD-609 Code
e0
e0
Number of Elements
1
1
Number of Terminals
3
2
Package Body Material
UNSPECIFIED
GLASS
Package Shape
SQUARE
ROUND
Package Style
UNCASED CHIP
LONG FORM
Power Dissipation-Max
0.5 W
0.5 W
Qualification Status
Qualified
Not Qualified
Reference Standard
MIL-19500/159M
MIL-19500/159M
Reference Voltage-Nom
6.2 V
6.2 V
Surface Mount
YES
NO
Technology
ZENER
ZENER
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
NO LEAD
WIRE
Terminal Position
UPPER
AXIAL
Voltage Tol-Max
5%
5%
Base Number Matches
4
5
Part Package Code
DO-7
Pin Count
2
ECCN Code
EAR99
HTS Code
8541.10.00.50
Additional Feature
METALLURGICALLY BONDED
Case Connection
ISOLATED
Dynamic Impedance-Max
15 Ω
JEDEC-95 Code
DO-35
Operating Temperature-Max
175 °C
Operating Temperature-Min
-65 °C
Voltage Temp Coeff-Max
0.062 mV/°C
Working Test Current
7.5 mA
Compare JANKCA1N827 with alternatives
Compare JANTXV1N827 with alternatives