JAN1N6761-1
vs
JAN1N6761-1
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROSEMI CORP
Package Description
HERMETIC SEALED PACKAGE-2
HERMETIC SEALED PACKAGE-2
Reach Compliance Code
compliant
unknown
Factory Lead Time
24 Weeks
Additional Feature
HIGH RELIABILITY
METALLURGICALLY BONDED
Application
GENERAL PURPOSE
GENERAL PURPOSE
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
RECTIFIER DIODE
RECTIFIER DIODE
Forward Voltage-Max (VF)
0.69 V
JEDEC-95 Code
DO-41
DO-41
JESD-30 Code
O-LALF-W2
O-XALF-W2
JESD-609 Code
e0
e0
Non-rep Pk Forward Current-Max
25 A
Number of Elements
1
1
Number of Phases
1
1
Number of Terminals
2
2
Operating Temperature-Max
150 °C
Operating Temperature-Min
-65 °C
Output Current-Max
1 A
1 A
Package Body Material
GLASS
UNSPECIFIED
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Qualification Status
Qualified
Not Qualified
Reference Standard
MIL-PRF-19500; MIL-STD-750
MIL-19500/586
Rep Pk Reverse Voltage-Max
100 V
100 V
Reverse Current-Max
100 µA
Reverse Test Voltage
100 V
Surface Mount
NO
NO
Technology
SCHOTTKY
SCHOTTKY
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
WIRE
WIRE
Terminal Position
AXIAL
AXIAL
Base Number Matches
1
1
Pbfree Code
Part Package Code
DO-41
Pin Count
2
ECCN Code
EAR99
HTS Code
8541.10.00.80
Compare JAN1N6761-1 with alternatives
Compare JAN1N6761-1 with alternatives