JAN1N6642U
vs
1N6642USE3
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
BKC SEMICONDUCTORS INC
MICROCHIP TECHNOLOGY INC
Package Description
SURFACEMOUNT PACKAGE-2
ROHS COMPLIANT, HERMETIC SEALED, GLASS, D-5B, SQ-MELF, B PACKAGE-2
Reach Compliance Code
unknown
compliant
Additional Feature
METALLURGICALLY BONDED
Application
GENERAL PURPOSE
GENERAL PURPOSE
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
RECTIFIER DIODE
RECTIFIER DIODE
JESD-30 Code
O-XELF-R2
O-LELF-R2
Number of Elements
1
1
Number of Phases
1
1
Number of Terminals
2
2
Output Current-Max
0.3 A
0.3 A
Package Body Material
UNSPECIFIED
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Qualification Status
Not Qualified
Reference Standard
MIL-19500/578E
Reverse Recovery Time-Max
0.005 µs
0.005 µs
Surface Mount
YES
YES
Terminal Form
WRAP AROUND
WRAP AROUND
Terminal Position
END
END
Base Number Matches
2
1
Rohs Code
Factory Lead Time
23 Weeks
Samacsys Manufacturer
Microchip
Operating Temperature-Max
175 °C
Operating Temperature-Min
-65 °C
Rep Pk Reverse Voltage-Max
75 V
Compare JAN1N6642U with alternatives
Compare 1N6642USE3 with alternatives