1N6642USE3
vs
JANS1N6642US
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
MICROSEMI CORP
DEFENSE LOGISTICS AGENCY
Part Package Code
MELF
Package Description
ROHS COMPLIANT, HERMETIC SEALED, GLASS, D-5B, SQ-MELF, B PACKAGE-2
SURFACEMOUNT PACKAGE-2
Pin Count
2
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
HTS Code
8541.10.00.70
Samacsys Manufacturer
Microsemi Corporation
Application
GENERAL PURPOSE
GENERAL PURPOSE
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
RECTIFIER DIODE
RECTIFIER DIODE
JESD-30 Code
O-LELF-R2
O-XELF-R2
Number of Elements
1
1
Number of Phases
1
1
Number of Terminals
2
2
Operating Temperature-Max
175 °C
Operating Temperature-Min
-65 °C
Output Current-Max
0.3 A
0.3 A
Package Body Material
GLASS
UNSPECIFIED
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Rep Pk Reverse Voltage-Max
75 V
75 V
Reverse Recovery Time-Max
0.005 µs
0.005 µs
Surface Mount
YES
YES
Terminal Form
WRAP AROUND
WRAP AROUND
Terminal Position
END
END
Base Number Matches
2
10
Additional Feature
METALLURGICALLY BONDED
Qualification Status
Qualified
Reference Standard
MIL-19500/578E
Compare 1N6642USE3 with alternatives
Compare JANS1N6642US with alternatives