JAN1N6640US
vs
JANTX1N6640US
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
SENSITRON SEMICONDUCTOR
Package Description
SURFACE MOUNT PACKAGE-2
SURFACE MOUNT PACKAGE-2
Reach Compliance Code
compliant
compliant
Additional Feature
METALLURGICALLY BONDED
METALLURGICALLY BONDED
Application
GENERAL PURPOSE
GENERAL PURPOSE
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
RECTIFIER DIODE
RECTIFIER DIODE
JESD-30 Code
O-XELF-R2
O-XELF-R2
JESD-609 Code
e0
Number of Elements
1
1
Number of Phases
1
1
Number of Terminals
2
2
Output Current-Max
0.3 A
0.3 A
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Qualification Status
Qualified
Qualified
Reference Standard
MIL-19500/609D
MIL-19500/609D
Reverse Recovery Time-Max
0.004 µs
0.004 µs
Surface Mount
YES
YES
Terminal Finish
TIN LEAD
Terminal Form
WRAP AROUND
WRAP AROUND
Terminal Position
END
END
Base Number Matches
1
1
Pbfree Code
Pin Count
2
ECCN Code
EAR99
HTS Code
8541.10.00.70
Factory Lead Time
39 Weeks
Forward Voltage-Max (VF)
1.1 V
Non-rep Pk Forward Current-Max
2.5 A
Operating Temperature-Max
175 °C
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Rep Pk Reverse Voltage-Max
75 V
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare JAN1N6640US with alternatives
Compare JANTX1N6640US with alternatives