JAN1N6640
vs
1N659
feature comparison
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
AEROFLEX/METELICS INC
|
BKC SEMICONDUCTORS INC
|
Package Description |
HERMETIC SEALED GLASS PACKAGE-2
|
|
Pin Count |
2
|
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
|
HTS Code |
8541.10.00.70
|
|
Additional Feature |
METALLURGICALLY BONDED
|
|
Case Connection |
ISOLATED
|
ISOLATED
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
JESD-30 Code |
O-LALF-W2
|
O-LALF-W2
|
JESD-609 Code |
e0
|
e0
|
Number of Elements |
1
|
1
|
Number of Terminals |
2
|
2
|
Output Current-Max |
0.3 A
|
0.2 A
|
Package Body Material |
GLASS
|
GLASS
|
Package Shape |
ROUND
|
ROUND
|
Package Style |
LONG FORM
|
LONG FORM
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Reference Standard |
MIL-19500/578
|
|
Rep Pk Reverse Voltage-Max |
50 V
|
60 V
|
Reverse Recovery Time-Max |
0.004 µs
|
0.3 µs
|
Surface Mount |
NO
|
NO
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
WIRE
|
WIRE
|
Terminal Position |
AXIAL
|
AXIAL
|
Base Number Matches |
10
|
7
|
Rohs Code |
|
No
|
Forward Voltage-Max (VF) |
|
1 V
|
Number of Phases |
|
1
|
Operating Temperature-Max |
|
150 °C
|
Power Dissipation-Max |
|
0.5 W
|
Reverse Current-Max |
|
5 µA
|
|
|
|
Compare JAN1N6640 with alternatives
Compare 1N659 with alternatives