JAN1N6639US
vs
JANTXV1N6639
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
MICROSEMI CORP
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
SURFACE MOUNT PACKAGE-2
|
SIMILAR TO DO-35, 2 PIN
|
Pin Count |
2
|
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
EAR99
|
|
HTS Code |
8541.10.00.70
|
|
Samacsys Manufacturer |
Microsemi Corporation
|
|
Additional Feature |
METALLURGICALLY BONDED
|
METALLURGICALLY BONDED
|
Application |
GENERAL PURPOSE
|
GENERAL PURPOSE
|
Case Connection |
ISOLATED
|
ISOLATED
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
JESD-30 Code |
O-XELF-R2
|
O-XALF-W2
|
JESD-609 Code |
e0
|
e0
|
Number of Elements |
1
|
1
|
Number of Phases |
1
|
1
|
Number of Terminals |
2
|
2
|
Output Current-Max |
0.3 A
|
0.3 A
|
Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
Package Shape |
ROUND
|
ROUND
|
Package Style |
LONG FORM
|
LONG FORM
|
Qualification Status |
Not Qualified
|
Qualified
|
Reference Standard |
MIL-19500/609D
|
MIL-19500/609D
|
Reverse Recovery Time-Max |
0.004 µs
|
0.004 µs
|
Surface Mount |
YES
|
NO
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
WRAP AROUND
|
WIRE
|
Terminal Position |
END
|
AXIAL
|
Base Number Matches |
1
|
2
|
Factory Lead Time |
|
23 Weeks
|
Forward Voltage-Max (VF) |
|
1.2 V
|
JEDEC-95 Code |
|
DO-35
|
Non-rep Pk Forward Current-Max |
|
2.5 A
|
Operating Temperature-Max |
|
175 °C
|
Operating Temperature-Min |
|
-65 °C
|
Reverse Current-Max |
|
0.1 µA
|
|
|
|
Compare JAN1N6639US with alternatives
Compare JANTXV1N6639 with alternatives