JAN1N5524B-1
vs
1N5524BE3
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
AEROFLEX/METELICS INC
MICROSEMI CORP
Part Package Code
DO-35
DO-35
Package Description
HERMETIC SEALED PACKAGE-2
O-XALF-W2
Pin Count
2
2
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.50
8541.10.00.50
Additional Feature
METALLURGICALLY BONDED
METALLURGICALLY BONDED
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JEDEC-95 Code
DO-35
DO-35
JESD-30 Code
O-PALF-W2
O-XALF-W2
JESD-609 Code
e0
e3
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
175 °C
175 °C
Operating Temperature-Min
-65 °C
-65 °C
Package Body Material
PLASTIC/EPOXY
UNSPECIFIED
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.5 W
0.5 W
Qualification Status
Not Qualified
Reference Standard
MIL-19500/437
MIL-19500/437E
Reference Voltage-Nom
5.6 V
5.6 V
Surface Mount
NO
NO
Technology
ZENER
ZENER
Terminal Finish
TIN LEAD
MATTE TIN
Terminal Form
WIRE
WIRE
Terminal Position
AXIAL
AXIAL
Voltage Tol-Max
5%
5%
Working Test Current
0.003 mA
3 mA
Base Number Matches
8
1
Rohs Code
Dynamic Impedance-Max
30 Ω
Compare JAN1N5524B-1 with alternatives
Compare 1N5524BE3 with alternatives