1N5524BE3
vs
1N5524B
feature comparison
All Stats
Differences Only
Rohs Code
Yes
Yes
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
MICROSEMI CORP
M/A-COM TECHNOLOGY SOLUTIONS INC
Part Package Code
DO-35
Package Description
O-XALF-W2
GLASS PACKAGE-2
Pin Count
2
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.50
8541.10.00.50
Additional Feature
METALLURGICALLY BONDED
LOW NOISE
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
Dynamic Impedance-Max
30 Ω
JEDEC-95 Code
DO-35
DO-7
JESD-30 Code
O-XALF-W2
O-LALF-W2
JESD-609 Code
e3
e0
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
175 °C
Operating Temperature-Min
-65 °C
Package Body Material
UNSPECIFIED
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.5 W
Reference Standard
MIL-19500/437E
Reference Voltage-Nom
5.6 V
5.6 V
Surface Mount
NO
NO
Technology
ZENER
AVALANCHE
Terminal Finish
MATTE TIN
TIN LEAD
Terminal Form
WIRE
WIRE
Terminal Position
AXIAL
AXIAL
Voltage Tol-Max
5%
5%
Working Test Current
3 mA
3 mA
Base Number Matches
1
24
Date Of Intro
1994-06-01
Qualification Status
Not Qualified
Compare 1N5524BE3 with alternatives
Compare 1N5524B with alternatives