JAN1N5308UR-1
vs
JANTXV1N5308UR-1
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
DEFENSE LOGISTICS AGENCY
MICROSEMI CORP
Package Description
HERMETIC SEALED PACKAGE-2
HERMETIC SEALED, GLASS, LL41, MELF-2
Reach Compliance Code
unknown
unknown
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
CURRENT REGULATOR DIODE
CURRENT REGULATOR DIODE
JEDEC-95 Code
DO-213AB
DO-213AB
JESD-30 Code
O-XELF-R2
O-LELF-R2
Limiting Voltage-Max
2.15 V
2.15 V
Number of Elements
1
1
Number of Terminals
2
2
Package Body Material
UNSPECIFIED
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Power Dissipation-Max
0.5 W
0.5 W
Qualification Status
Qualified
Not Qualified
Reference Standard
MIL-19500/463G
MIL-19500
Regulation Current-Nom (Ireg)
2.7 mA
2.7 mA
Rep Pk Reverse Voltage-Max
100 V
Surface Mount
YES
YES
Technology
FIELD EFFECT
FIELD EFFECT
Terminal Form
WRAP AROUND
WRAP AROUND
Terminal Position
END
END
Base Number Matches
1
1
Pbfree Code
Rohs Code
Part Package Code
DO-213AB
Pin Count
2
ECCN Code
EAR99
HTS Code
8541.10.00.70
Samacsys Manufacturer
Microsemi Corporation
Additional Feature
METALLURGICALLY BONDED
JESD-609 Code
e0
Moisture Sensitivity Level
1
Operating Temperature-Max
175 °C
Operating Temperature-Min
-65 °C
Terminal Finish
TIN LEAD
Compare JAN1N5308UR-1 with alternatives
Compare JANTXV1N5308UR-1 with alternatives