JANTXV1N5308UR-1
vs
JANS1N5308UR-1
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
COMPENSATED DEVICES INC
MICROCHIP TECHNOLOGY INC
Package Description
HERMETIC SEALED PACKAGE-2
HERMETIC SEALED, GLASS, LL41, MELF-2
Reach Compliance Code
unknown
compliant
Additional Feature
METALLURGICALLY BONDED
METALLURGICALLY BONDED
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
CURRENT REGULATOR DIODE
CURRENT REGULATOR DIODE
JEDEC-95 Code
DO-213AB
DO-213AB
JESD-30 Code
O-XELF-R2
O-LELF-R2
Knee Impedance-Max
35000 Ω
Limiting Voltage-Max
2.15 V
2.15 V
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
175 °C
175 °C
Operating Temperature-Min
-65 °C
-65 °C
Package Body Material
UNSPECIFIED
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Power Dissipation-Max
0.5 W
0.5 W
Qualification Status
Not Qualified
Qualified
Reference Standard
MIL-19500/463G
MIL-19500
Regulation Current-Nom (Ireg)
2.7 mA
2.7 mA
Rep Pk Reverse Voltage-Max
100 V
100 V
Surface Mount
YES
YES
Technology
FIELD EFFECT
FIELD EFFECT
Terminal Form
WRAP AROUND
WRAP AROUND
Terminal Position
END
END
Base Number Matches
8
8
Rohs Code
JESD-609 Code
e0
Moisture Sensitivity Level
1
Terminal Finish
TIN LEAD
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