JAN1N5297UR-1
vs
JANTX1N5297UR-1
feature comparison
All Stats
Differences Only
Rohs Code
No
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
AEROFLEX/METELICS INC
Package Description
HERMETIC SEALED, GLASS, LL41, MELF-2
Reach Compliance Code
compliant
unknown
Factory Lead Time
21 Weeks
Category CO2 Kg
8.54
Compliance Temperature Grade
Military: -65C to +175C
Candidate List Date
2020-06-25
Conflict Mineral Status
DRC Conflict Free
Conflict Mineral Status Source
CMRT V5.10
Qualifications
DLA
Additional Feature
METALLURGICALLY BONDED
METALLURGICALLY BONDED
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
CURRENT REGULATOR DIODE
CURRENT REGULATOR DIODE
JEDEC-95 Code
DO-213AB
DO-213AB
JESD-30 Code
O-LELF-R2
O-XELF-R2
JESD-609 Code
e0
e0
Limiting Voltage-Max
1.35 V
1.35 V
Moisture Sensitivity Level
1
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
175 °C
175 °C
Operating Temperature-Min
-65 °C
-65 °C
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Power Dissipation-Max
0.5 W
0.5 W
Qualification Status
Qualified
Not Qualified
Reference Standard
MIL-19500
MIL-19500
Regulation Current-Nom (Ireg)
1 mA
1 mA
Rep Pk Reverse Voltage-Max
100 V
Surface Mount
YES
YES
Technology
FIELD EFFECT
FIELD EFFECT
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
WRAP AROUND
WRAP AROUND
Terminal Position
END
END
Base Number Matches
2
1
ECCN Code
EAR99
HTS Code
8541.10.00.70
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