JAN1N4958C vs BZV47C10 feature comparison

JAN1N4958C Microchip Technology Inc

Buy Now Datasheet

BZV47C10 STMicroelectronics

Buy Now Datasheet
Rohs Code No No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer MICROCHIP TECHNOLOGY INC STMICROELECTRONICS
Package Description HERMETIC SEALED, GLASS PACKAGE-2 O-PALF-W2
Reach Compliance Code compliant compliant
Factory Lead Time 28 Weeks
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JESD-30 Code O-LALF-W2 O-PALF-W2
JESD-609 Code e0
Number of Elements 1 1
Number of Terminals 2 2
Package Body Material GLASS PLASTIC/EPOXY
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 5 W 2 W
Qualification Status Qualified Not Qualified
Reference Standard MIL-19500/356H
Reference Voltage-Nom 10 V 10 V
Surface Mount NO NO
Technology ZENER ZENER
Terminal Finish TIN LEAD
Terminal Form WIRE WIRE
Terminal Position AXIAL AXIAL
Voltage Tol-Max 2% 5%
Working Test Current 125 mA 50 mA
Base Number Matches 2 3
Pin Count 2
ECCN Code EAR99
HTS Code 8541.10.00.50
Dynamic Impedance-Max 4 Ω
Operating Temperature-Max 175 °C
Operating Temperature-Min -65 °C
Reverse Current-Max 5 µA
Voltage Temp Coeff-Max 5.5 mV/°C

Compare JAN1N4958C with alternatives

Compare BZV47C10 with alternatives