JAN1N4469US
vs
SZN4469DSMS
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
MICROSEMI CORP
SOLID STATE DEVICES INC
Package Description
HERMETIC SEALED, GLASS PACKAGE-2
O-LELF-R2
Pin Count
2
2
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.50
8541.10.00.50
Additional Feature
METALLURGICALLY BONDED
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JESD-30 Code
O-LELF-R2
O-LELF-R2
JESD-609 Code
e0
Number of Elements
1
1
Number of Terminals
2
2
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
1.5 W
1.5 W
Qualification Status
Not Qualified
Not Qualified
Reference Standard
MIL-19500
Reference Voltage-Nom
15 V
15 V
Surface Mount
YES
YES
Technology
ZENER
ZENER
Terminal Finish
TIN LEAD
Terminal Form
WRAP AROUND
WRAP AROUND
Terminal Position
END
END
Voltage Tol-Max
5%
1%
Working Test Current
17 mA
17 mA
Base Number Matches
3
5
Operating Temperature-Max
175 °C
Operating Temperature-Min
-65 °C
Compare JAN1N4469US with alternatives
Compare SZN4469DSMS with alternatives