JAN1N4466US vs 1N4466US feature comparison

JAN1N4466US Microchip Technology Inc

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1N4466US Semtech Corporation

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Rohs Code No
Part Life Cycle Code Active Transferred
Ihs Manufacturer MICROCHIP TECHNOLOGY INC SEMTECH CORP
Package Description HERMETIC SEALED, GLASS PACKAGE-2 HERMETIC SEALED PACKAGE-2
Reach Compliance Code compliant unknown
Factory Lead Time 28 Weeks 15 Weeks
Additional Feature METALLURGICALLY BONDED
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JESD-30 Code O-LELF-R2 O-LELF-R2
JESD-609 Code e0
Number of Elements 1 1
Number of Terminals 2 2
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 1.5 W 1.5 W
Qualification Status Qualified Not Qualified
Reference Standard MIL-19500
Reference Voltage-Nom 11 V 11 V
Surface Mount YES YES
Technology ZENER ZENER
Terminal Finish TIN LEAD
Terminal Form WRAP AROUND WRAP AROUND
Terminal Position END END
Voltage Tol-Max 5% 5%
Working Test Current 23 mA 23 mA
Base Number Matches 6 6
Pin Count 2
ECCN Code EAR99
HTS Code 8541.10.00.50
Samacsys Manufacturer SEMTECH
Dynamic Impedance-Max 6 Ω
Operating Temperature-Max 175 °C

Compare JAN1N4466US with alternatives

Compare 1N4466US with alternatives