JAN1N4370AUR-1
vs
MMSZ5223BT1G
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
ONSEMI
Package Description
MELF-2
Reach Compliance Code
compliant
compliant
Factory Lead Time
20 Weeks
Additional Feature
METALLURGICALLY BONDED
Case Connection
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
Dynamic Impedance-Max
30 Ω
30 Ω
JEDEC-95 Code
DO-213AA
JESD-30 Code
O-LELF-R2
R-PDSO-G2
JESD-609 Code
e0
e3
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
175 °C
150 °C
Operating Temperature-Min
-65 °C
-55 °C
Package Body Material
GLASS
PLASTIC/EPOXY
Package Shape
ROUND
RECTANGULAR
Package Style
LONG FORM
SMALL OUTLINE
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.5 W
0.5 W
Qualification Status
Qualified
Not Qualified
Reference Standard
MIL-19500
Reference Voltage-Nom
2.4 V
2.7 V
Reverse Current-Max
100 µA
Reverse Test Voltage
1 V
Surface Mount
YES
YES
Technology
ZENER
ZENER
Terminal Finish
Tin/Lead (Sn/Pb)
MATTE TIN
Terminal Form
WRAP AROUND
GULL WING
Terminal Position
END
DUAL
Voltage Temp Coeff-Max
-2.04 mV/°C
Voltage Tol-Max
5%
5%
Working Test Current
20 mA
20 mA
Base Number Matches
1
2
Pbfree Code
Part Package Code
SOD-123 2 LEAD
Pin Count
2
Manufacturer Package Code
425-04
ECCN Code
EAR99
HTS Code
8541.10.00.50
Samacsys Manufacturer
onsemi
Moisture Sensitivity Level
1
Peak Reflow Temperature (Cel)
260
Time@Peak Reflow Temperature-Max (s)
30
Compare JAN1N4370AUR-1 with alternatives
Compare MMSZ5223BT1G with alternatives