JAN1N3154-1
vs
RH3154-1
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
MICROSEMI CORP
MICROSEMI CORP
Part Package Code
DO-7
DO-7
Package Description
HERMETIC SEALED, GLASS, SIMILAR TO DO-7, 2 PIN
O-LALF-W2
Pin Count
2
2
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.50
8541.10.00.50
Additional Feature
METALLURGICALLY BONDED
METALLURGICAL BONDED
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JEDEC-95 Code
DO-35
DO-204AA
JESD-30 Code
O-LALF-W2
O-LALF-W2
JESD-609 Code
e0
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
175 °C
100 °C
Operating Temperature-Min
-65 °C
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Power Dissipation-Max
0.5 W
0.5 W
Qualification Status
Not Qualified
Not Qualified
Reference Standard
MIL-19500/158P
Reference Voltage-Nom
8.4 V
8.4 V
Surface Mount
NO
NO
Technology
ZENER
ZENER
Terminal Finish
TIN LEAD
Terminal Form
WIRE
WIRE
Terminal Position
AXIAL
AXIAL
Voltage Temp Coeff-Max
0.84 mV/°C
0.84 mV/°C
Voltage Tol-Max
5%
4.76%
Base Number Matches
4
1
Dynamic Impedance-Max
15 Ω
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Working Test Current
10 mA
Compare JAN1N3154-1 with alternatives
Compare RH3154-1 with alternatives