JAN1N3026B-1
vs
BZV85-C18,133
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
NEXPERIA
|
| Package Description |
DO-41, 2 PIN
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| Additional Feature |
METALLURGICALLY BONDED
|
|
| Case Connection |
ISOLATED
|
ISOLATED
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
ZENER DIODE
|
ZENER DIODE
|
| JEDEC-95 Code |
DO-41
|
DO-41
|
| JESD-30 Code |
O-XALF-W2
|
O-LALF-W2
|
| JESD-609 Code |
e0
|
e3
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Package Body Material |
UNSPECIFIED
|
GLASS
|
| Package Shape |
ROUND
|
ROUND
|
| Package Style |
LONG FORM
|
LONG FORM
|
| Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
| Power Dissipation-Max |
1 W
|
1 W
|
| Qualification Status |
Qualified
|
|
| Reference Standard |
MIL-19500/115K
|
IEC-60134
|
| Reference Voltage-Nom |
18 V
|
18 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
ZENER
|
ZENER
|
| Terminal Finish |
TIN LEAD
|
TIN
|
| Terminal Form |
WIRE
|
WIRE
|
| Terminal Position |
AXIAL
|
AXIAL
|
| Voltage Tol-Max |
5%
|
5%
|
| Working Test Current |
14 mA
|
15 mA
|
| Base Number Matches |
1
|
1
|
| Part Package Code |
|
DO-4
|
| Pin Count |
|
2
|
| Manufacturer Package Code |
|
SOD66
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8541.10.00.50
|
| Samacsys Manufacturer |
|
Nexperia
|
| Moisture Sensitivity Level |
|
1
|
| Operating Temperature-Max |
|
200 °C
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare JAN1N3026B-1 with alternatives
Compare BZV85-C18,133 with alternatives
-
BZV85-C18,133 vs 1N4746A-T3
-
BZV85-C18,133 vs MZP4746ARR2
-
BZV85-C18,133 vs 1N4746A,113
-
BZV85-C18,133 vs 1N4746A
-
BZV85-C18,133 vs 1N4746A-G
-
BZV85-C18,133 vs MV1N4746APE3
-
BZV85-C18,133 vs MX1N4746AGE3TR
-
BZV85-C18,133 vs 1N4746AG
-
BZV85-C18,133 vs MQ1N4746APE3TR