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JAN1N3024CUR-1 vs MQ1N4744CUR feature comparison

JAN1N3024CUR-1 Microchip Technology Inc

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MQ1N4744CUR Microsemi Corporation

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Rohs Code No No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROSEMI CORP
Package Description DO-213AB, 2 PIN O-LELF-R2
Reach Compliance Code compliant unknown
Factory Lead Time 20 Weeks
Additional Feature METALLURGICALLY BONDED HIGH RELIABILITY
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JEDEC-95 Code DO-213AB DO-213AB
JESD-30 Code O-LELF-R2 O-LELF-R2
JESD-609 Code e0 e0
Number of Elements 1 1
Number of Terminals 2 2
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 1 W 1 W
Qualification Status Qualified Not Qualified
Reference Standard MIL-19500/115K MIL-19500
Reference Voltage-Nom 15 V 15 V
Surface Mount YES YES
Technology ZENER ZENER
Terminal Finish TIN LEAD TIN LEAD
Terminal Form WRAP AROUND WRAP AROUND
Terminal Position END END
Voltage Tol-Max 2% 2%
Working Test Current 17 mA 17 mA
Base Number Matches 1 9
Part Package Code DO-213AB
Pin Count 2
ECCN Code EAR99
HTS Code 8541.10.00.50
Moisture Sensitivity Level 1
Operating Temperature-Max 175 °C
Operating Temperature-Min -65 °C
Diodes » Zener Diodes
Diodes » Zener Diodes

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