JAN1N3024CUR-1 vs 1N3024CUR-1 feature comparison

JAN1N3024CUR-1 Microchip Technology Inc

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1N3024CUR-1 Microsemi Corporation

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Rohs Code No No
Part Life Cycle Code Active Transferred
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROSEMI CORP
Package Description DO-213AB, 2 PIN O-LELF-R2
Reach Compliance Code compliant not_compliant
Factory Lead Time 20 Weeks
Additional Feature METALLURGICALLY BONDED METALLURGICALLY BONDED
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JEDEC-95 Code DO-213AB DO-213AB
JESD-30 Code O-LELF-R2 O-LELF-R2
JESD-609 Code e0 e0
Number of Elements 1 1
Number of Terminals 2 2
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 1 W 1 W
Qualification Status Qualified Not Qualified
Reference Standard MIL-19500/115K
Reference Voltage-Nom 15 V 15 V
Surface Mount YES YES
Technology ZENER ZENER
Terminal Finish TIN LEAD TIN LEAD
Terminal Form WRAP AROUND WRAP AROUND
Terminal Position END END
Voltage Tol-Max 2% 2%
Working Test Current 17 mA 17 mA
Base Number Matches 1 24
Pbfree Code No
Part Package Code DO-213AB
Pin Count 2
ECCN Code EAR99
HTS Code 8541.10.00.50

Compare JAN1N3024CUR-1 with alternatives

Compare 1N3024CUR-1 with alternatives