JAN1N2831RD vs 1N3332RB feature comparison

JAN1N2831RD Microsemi Corporation

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1N3332RB New England Semiconductor

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Rohs Code No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer MICROSEMI CORP NEW ENGLAND SEMICONDUCTOR
Part Package Code TO-3
Package Description O-MBFM-P2 HERMETIC SEALED, DO-5, 1 PIN
Pin Count 2
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8541.10.00.50
Case Connection CATHODE CATHODE
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JEDEC-95 Code TO-204AD DO-5
JESD-30 Code O-MBFM-P2 O-MUPM-D1
Number of Elements 1 1
Number of Terminals 2 1
Operating Temperature-Max 175 °C 175 °C
Operating Temperature-Min -65 °C -65 °C
Package Body Material METAL METAL
Package Shape ROUND ROUND
Package Style FLANGE MOUNT POST/STUD MOUNT
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 50 W 50 W
Qualification Status Not Qualified Not Qualified
Reference Standard MIL-19500
Reference Voltage-Nom 51 V 51 V
Surface Mount NO NO
Technology ZENER ZENER
Terminal Form PIN/PEG SOLDER LUG
Terminal Position BOTTOM UPPER
Voltage Tol-Max 1% 5%
Working Test Current 245 mA 245 mA
Base Number Matches 1 9
Additional Feature HIGH RELIABILITY
Dynamic Impedance-Max 5.2 Ω
Knee Impedance-Max 100 Ω
Reverse Current-Max 5 µA
Voltage Temp Coeff-Max 45.9 mV/°C

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