ISPLSI5512V-70LB388
vs
ISPLSI5512V-100LB388
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
LATTICE SEMICONDUCTOR CORP
LATTICE SEMICONDUCTOR CORP
Part Package Code
BGA
BGA
Package Description
BGA-388
BGA-388
Pin Count
388
388
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.D
3A991.D
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
YES
YES
Clock Frequency-Max
43.5 MHz
64.5 MHz
In-System Programmable
YES
YES
JESD-30 Code
S-PBGA-B388
S-PBGA-B388
JESD-609 Code
e0
e0
JTAG BST
YES
YES
Length
35 mm
35 mm
Moisture Sensitivity Level
3
3
Number of Dedicated Inputs
Number of I/O Lines
288
288
Number of Macro Cells
512
512
Number of Terminals
388
388
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
0 DEDICATED INPUTS, 288 I/O
0 DEDICATED INPUTS, 288 I/O
Output Function
MACROCELL
MACROCELL
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA388,26X26,50
BGA388,26X26,50
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
225
225
Programmable Logic Type
EE PLD
EE PLD
Propagation Delay
19 ns
13 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.25 mm
3.25 mm
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
3 V
3 V
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
35 mm
35 mm
Base Number Matches
1
1
Compare ISPLSI5512V-70LB388 with alternatives
Compare ISPLSI5512V-100LB388 with alternatives