ISPLSI5256VE-165LB272
vs
ISPLSI5256VE-100LB272I
feature comparison
Pbfree Code |
No
|
No
|
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
LATTICE SEMICONDUCTOR CORP
|
LATTICE SEMICONDUCTOR CORP
|
Part Package Code |
BGA
|
BGA
|
Package Description |
BGA-272
|
BGA-272
|
Pin Count |
272
|
272
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Additional Feature |
YES
|
YES
|
Clock Frequency-Max |
118 MHz
|
67 MHz
|
In-System Programmable |
YES
|
YES
|
JESD-30 Code |
S-PBGA-B272
|
S-PBGA-B272
|
JTAG BST |
YES
|
YES
|
Length |
27 mm
|
27 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of Dedicated Inputs |
|
|
Number of I/O Lines |
144
|
144
|
Number of Macro Cells |
256
|
256
|
Number of Terminals |
272
|
272
|
Operating Temperature-Max |
70 °C
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Organization |
0 DEDICATED INPUTS, 144 I/O
|
0 DEDICATED INPUTS, 144 I/O
|
Output Function |
MACROCELL
|
MACROCELL
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Equivalence Code |
BGA272,20X20,50
|
BGA272,20X20,50
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Peak Reflow Temperature (Cel) |
225
|
225
|
Programmable Logic Type |
EE PLD
|
EE PLD
|
Propagation Delay |
6 ns
|
10 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.8 mm
|
2.8 mm
|
Supply Voltage-Max |
3.6 V
|
3.6 V
|
Supply Voltage-Min |
3 V
|
3 V
|
Supply Voltage-Nom |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
27 mm
|
27 mm
|
Base Number Matches |
1
|
1
|
|
|
|
Compare ISPLSI5256VE-165LB272 with alternatives
Compare ISPLSI5256VE-100LB272I with alternatives