ISL89163FBEBZ
vs
ISL89163FBEBZ-T7
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
INTERSIL CORP
|
RENESAS ELECTRONICS CORP
|
| Part Package Code |
DFN, SOIC
|
|
| Package Description |
ROHS COMPLIANT, PLASTIC, SOIC-8
|
,
|
| Pin Count |
8, 8
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
4 Weeks
|
|
| High Side Driver |
YES
|
|
| Interface IC Type |
AND GATE BASED MOSFET DRIVER
|
AND GATE BASED MOSFET DRIVER
|
| JESD-30 Code |
R-PDSO-G8
|
|
| JESD-609 Code |
e3
|
e3
|
| Length |
4.89 mm
|
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
1
|
|
| Number of Terminals |
8
|
|
| Operating Temperature-Max |
125 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Output Peak Current Limit-Nom |
6 A
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
HSOP
|
|
| Package Equivalence Code |
SOP8,.25
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG
|
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1.72 mm
|
|
| Supply Voltage-Max |
16 V
|
|
| Supply Voltage-Min |
4.5 V
|
|
| Supply Voltage-Nom |
12 V
|
|
| Surface Mount |
YES
|
|
| Temperature Grade |
AUTOMOTIVE
|
|
| Terminal Finish |
Matte Tin (Sn) - annealed
|
MATTE TIN
|
| Terminal Form |
GULL WING
|
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
DUAL
|
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Turn-off Time |
0.05 µs
|
|
| Turn-on Time |
0.05 µs
|
|
| Width |
3.9 mm
|
|
| Base Number Matches |
2
|
2
|
|
|
|
Compare ISL89163FBEBZ-T7 with alternatives