ISL84781IR
vs
ISL84780IVZ
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
INTERSIL CORP
|
RENESAS ELECTRONICS CORP
|
| Part Package Code |
QFN
|
|
| Package Description |
3 X 3 MM, PLASTIC, MO-220-VEED, QFN-16
|
TSSOP,
|
| Pin Count |
16
|
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog IC - Other Type |
SINGLE-ENDED MULTIPLEXER
|
SPDT
|
| JESD-30 Code |
S-PQCC-N16
|
R-PDSO-G16
|
| JESD-609 Code |
e0
|
e3
|
| Length |
3 mm
|
5 mm
|
| Moisture Sensitivity Level |
1
|
|
| Number of Channels |
1
|
1
|
| Number of Functions |
1
|
4
|
| Number of Terminals |
16
|
16
|
| On-state Resistance Match-Nom |
0.1 Ω
|
|
| On-state Resistance-Max (Ron) |
0.85 Ω
|
0.9 Ω
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
TSSOP
|
| Package Equivalence Code |
LCC16,.12SQ,20
|
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1 mm
|
1.1 mm
|
| Signal Current-Max |
0.3 A
|
|
| Supply Current-Max (Isup) |
0.0012 mA
|
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
1.6 V
|
1.6 V
|
| Supply Voltage-Nom (Vsup) |
1.8 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Switch-off Time-Max |
25 ns
|
22 ns
|
| Switch-on Time-Max |
33 ns
|
30 ns
|
| Switching |
BREAK-BEFORE-MAKE
|
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
MATTE TIN
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.65 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Width |
3 mm
|
4.4 mm
|
| Base Number Matches |
2
|
2
|
| Off-state Isolation-Nom |
|
68 dB
|
|
|
|
Compare ISL84781IR with alternatives