ISL81485IBZ
vs
MAX14770EATA+T
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
MAXIM INTEGRATED PRODUCTS INC
|
Package Description |
,
|
HVSON, SOLCC8,.12,25
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Date Of Intro |
2017-10-24
|
|
Samacsys Manufacturer |
Renesas Electronics
|
|
Interface IC Type |
LINE TRANSCEIVER
|
LINE TRANSCEIVER
|
JESD-609 Code |
e3
|
e3
|
Terminal Finish |
MATTE TIN
|
MATTE TIN
|
Base Number Matches |
2
|
1
|
Pbfree Code |
|
Yes
|
Part Package Code |
|
DFN
|
Pin Count |
|
8
|
Differential Output |
|
YES
|
Driver Number of Bits |
|
1
|
High Level Input Current-Max |
|
0.000001 A
|
Input Characteristics |
|
DIFFERENTIAL SCHMITT TRIGGER
|
Interface Standard |
|
EIA-422-B; TIA-422-B; EIA-485-A; TIA-485-A; V.11; X.27
|
JESD-30 Code |
|
S-PDSO-N8
|
Length |
|
3 mm
|
Moisture Sensitivity Level |
|
1
|
Number of Functions |
|
1
|
Number of Terminals |
|
8
|
Operating Temperature-Max |
|
125 °C
|
Operating Temperature-Min |
|
-40 °C
|
Out Swing-Min |
|
2.1 V
|
Output Low Current-Max |
|
0.001 A
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Code |
|
HVSON
|
Package Equivalence Code |
|
SOLCC8,.12,25
|
Package Shape |
|
SQUARE
|
Package Style |
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
|
260
|
Qualification Status |
|
Not Qualified
|
Receive Delay-Max |
|
28 ns
|
Receiver Number of Bits |
|
1
|
Seated Height-Max |
|
0.8 mm
|
Supply Current-Max |
|
4 mA
|
Supply Voltage-Max |
|
5.5 V
|
Supply Voltage-Min |
|
4.5 V
|
Supply Voltage-Nom |
|
5 V
|
Surface Mount |
|
YES
|
Technology |
|
BICMOS
|
Temperature Grade |
|
AUTOMOTIVE
|
Terminal Form |
|
NO LEAD
|
Terminal Pitch |
|
0.65 mm
|
Terminal Position |
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
Transmit Delay-Max |
|
28 ns
|
Width |
|
3 mm
|
|
|
|
Compare ISL81485IBZ with alternatives
Compare MAX14770EATA+T with alternatives